China IC Production to Grow at 15% CAGR through 2023
IC production in China is projected to increase at a compound annual growth rate of 15% between 2018 and 2023,…
Dual sensor 3D AOI boosts accuracy, reliability
The SQ3000 platform offers users the flexibility to choose a dual MRS sensor option for 3D microscopic image quality at…
Contactor boosts WLCSP test yield
Atlas WLCSP test contactors are claimed to achieve mechanical reliability through the rigid “cruciform” tip used in Multitest's QuadTech flat…
Ion implanters cut IGBT manufacturing process
The SOPHI-30 and SOPHI-400 are aimed to reduce process time, improving IGBT manufacturing procedures.
Imec develops functional 5nm BEOL solution
Imec is tackling shrinking interconnect challenges, including RC delays, with a full dual-damascene module that incorporates multi-patterning and multi-blocking.
Nanoprobing platform enables fast failure analysis
The flexProber system offers precise, repeatable, and stable probe placement on critical level features.
S/TEM combines hi-res, high-throughput analytics
The Themis S S/TEM includes optics, chemical detection, wide gap pole-piece and unique application software that ensures the platform covers…
PFIB system offers 20x faster milling rates
The Helios G4 PFIB system allows engineers to create larger samples for nanoprobing and TEM imaging.
RS adds 2 Zortrax 3D printers to its portfolio
The printers aim to help engineers quickly produce concept mock-ups, prototype products for functional testing or even low-volume production for…
FlexPoint laser modules get upgraded focusing mechanism
The new focusing mechanism allows stable beam positioning and low line positioning drift in machine vision, and offers focusing options…