2016-09-26 - Nordson March
Confinement ring isolates plasma on wafer
The ring focuses the plasma directly over the wafer to speed up the etching process and provide uniform plasma coverage.
2016-09-09 - KAIST
Roll-process technology packages flexible silicon ICs
The final silicon-based flexible NAND memory demonstrates stable memory operations and interconnections even under severe bending conditions.
2016-09-06 - Rich Quinnell
Consider using robots for mundane supply chain tasks
Systems handling SAP and MRP need overarching management by human operators, but most of these manual operations can also be…
2016-08-29 - Jennifer Chu
Heat-responsive 3D-printed items ‘remember’ their shapes
The structures spring back to their original forms within seconds of being heated to a certain temperature “sweet spot.”
2016-08-12 - Julien Happich
3D printed microlenses could shrink drone cameras
Using a new process, researchers printed optical free form surfaces and miniature objectives directly onto CMOS image chips.
2016-08-08 - Tom Fleischman
Carbon-capture tech converts CO2 to electrical energy
In current carbon-capture models, the carbon is captured in fluids or solids. Researchers suggest a paradigm shift.