MEMS group joins SEMI as strategic partner
The MEMS & Sensors Industry Group's "strategic association partnership" with SEMI, helps the latter diversify its interests.
Apple motivates interest in fan-out packaging
2016 is a turning point for the fan-out market since Apple and TSMC changed the game, possibly creating a trend…
Buyouts re-order analog rankings
What will the analog rankings look like when 2016 is over?
Deep learning doubles GPU memory efficiency
The technology reduces the volume of internal GPU memory used by over 40%.
Applied Materials, IME invest $139M in new R&D centre
The Singapore centre conducts multi-disciplinary research to develop new innovations for fan-out wafer-level packaging.
Chinese wearable shipments soar to 9.54M in Q2
Shipments of basic wearable devices, such as wristbands, children’s watches and smart running shoes, grew by 92.1%.
ON-Fairchild union: A match made in heaven?
Bringing together two established industry leaders, ON Semiconductor’s acquisition of Fairchild Semiconductor creates one extraordinary company.
Synopsys develops interface, foundation IP for TSMC’s 7nm
TSMC also certifies the complete suite of Synopsys' digital, signoff and custom implementation tools for the 7nm node.
IoT shift may greatly impact embedded developers
While IoT devices are embedded systems, not all embedded systems are IoT devices. At least, not yet.
Start-up secures $1M to develop diamond-based electronics
Evince Technology is developing a new family of devices including a diode, an embedded field emission triode and a bidirectional…