2017-08-09 - University of Heidelberg

Researchers reach for organic electrically pumped lasers

A light-emitting transistor with carbon nanotubes between mirrors for electrical generation of polaritons just got us closer to organic electrically…

2017-08-09 - Keysight Technologies

Keysight tests for 3GPP compliance with Monarch chip

The UXM Wireless Test Set is integrated with Sequans' Monarch LTE for IoT platform to support the testing needs of…

2017-08-09 - EE Times Asia

Cartesian manipulator wins Amazon Robotics Challenge

The third place went to Singapore's Nanyang Technological University, which has managed a first in the picking task and a…

2017-08-08 - Telink Semiconductor

Telink adds support for Bluetooth mesh networks

Telink's software development kit that not only meets standard specs but enables real-time updates and synchronised control for applications such…

2017-08-08 - TrendForce

China’s fab dream faces ‘enormous’ financial risk

The new fab projects will carry high depreciation costs, while the aggressive recruitment efforts by semiconductor manufacturers will raise the…

2017-08-07 - Multitest

Contactor boosts WLCSP test yield

Atlas WLCSP test contactors are claimed to achieve mechanical reliability through the rigid “cruciform” tip used in Multitest's QuadTech flat…

2017-08-07 - BSA

Survey: 1-in-10 Hong Kong companies face cyberattack

While some of the companies have performed backup more frequently after WannaCrypt, many are still resorting to more traditional ways…

2017-08-07 - IC Insights

DRAM, NAND drive first annual double-digit upturn

The expected 16% increase will be the first double-digit gain for the IC market since it expanded by 33% in…

2017-08-04 - Aalto University

Chemical route paves way for graphene in electronics

A group of researchers from Aalto University, Utrecht University and TU Delft in the Netherlands has set out to create…

2017-08-04 - Fairview Microwave

VCOs cover 10–4,350MHz frequency band

The oscillators come in a 0.5in hermetically sealed surface mount package designed to meet MIL-STD-883 and MIL-STD-202 environmental test conditions.