2016-09-23 - A*Star
Applied Materials, IME invest $139M in new R&D centre
The Singapore centre conducts multi-disciplinary research to develop new innovations for fan-out wafer-level packaging.
2016-07-06 - A*Star
Consortium advances solutions for high-volume chip packaging
The Chip-on-Wafer (CoW) Consortium II will build on the success of the first CoW consortium to further reduce production time…
2016-06-08 -
A*STAR IME’s consortium advances MEMS for industrial, IoT apps
A*STAR IME's collaborative partnership with industry will enable the development of industrial-grade sensors to increase the performance and develop cost-efficient…
2016-05-17 - A*STAR
High-conductive thermoplastic mat’l advances 3D printing
A*STAR IMRE scientists have come up with what they describe as a novel type of thermoplastic thread that can be…