Rambus, Winbond sign 5-year patent agreement

Article By : Rambus

The collaborative partnership aims to provide critical memory and interface technologies for data centres.

“In today’s data intensive applications, computing memory solutions must be more efficient, deliver higher levels of bandwidth and lower latency to solutions to meet the demands of the market,” said Luc Seraphin, general manager of the Interface Division at Rambus.

As a result, Rambus has recently signed a broad five-year patent license agreement with Taiwan's Winbond Electronics. The agreement covers the use of Rambus patented memory solutions, including server DIMM chipsets, for Winbond products through 2021.

The collaborative partnership aims to provide critical memory and interface technologies that address the needs and requirements to run effective data centres.