China wafer fab projects fuel global equipment sales
China is expected to be the top spending region for fab equipment spending in 2019 and 2020, overtaking South Korea…
NEC spearheads ASEAN cyber security training
The three-year training in Japan encompasses practical cyber-attack defence drills to render necessary drills, products and services to help in…
Xiaomi taps ex-Leadcore team to design SoC
Xiaomi’s new SoC, based on eight ARM A53 cores, is capable of LTE Cat 6.
Toshiba builds memory fab, R&D centre in Japan
Fab 6 will be dedicated to production of BiCS FLASH, Toshiba's 3D Flash memory, according to the company.
Is China ready for a memory chip fab?
With a lack of experienced engineers and equipment, will China’s decision to push into memory semiconductors be successful?
China tightens rules on offshore investments
The strong growth of offshore investment is causing political concerns in China and the United States.
IDC predicts growth in Indonesia’s digitalisation
IDC has predicted digital transformation will impact enterprises at the macro scale by 2020, forcing them to restrategise to meet…
Rambus, Winbond sign 5-year patent agreement
The collaborative partnership aims to provide critical memory and interface technologies for data centres.
Thai petrol station gets CIS solar power
CIS thin-film solar panels are installed on two rooftops of a Shell service station in Chacheongsao province.
Are China’s chipmakers poaching Taiwan’s execs?
Recruiting Taiwan’s veterans will help China’s chip industry accelerate their R&D upgrading, process technology and yield improvements.