2019-03-15 - Martin Rowe

University Adds NVMe over TCP Testing

The University of New Hampshire Interoperability Lab (UNH-IOL) has expanded its Non-Volatile-Memory-Express-over-Fabric (NVMe-oF) testing capabilities to include NVMe over TCP.

2019-03-13 - Gary Hilson

Compute and Memory Need to get Cosy

There's been much talk about which memories might best support AI and ML. But just as important are the architectures,…

2019-03-05 - Gary Hilson

1 TB Memories to Boost Smartphones

Consumers looking to store more 4K videos of their cats are in luck. Samsung Electronics recently began mass-producing one terabyte…

2019-03-01 - Dylan McGrath

Samsung Announces First 512GB Embedded UFS

Samsung Electronics said it has begun mass production of the first 512GB embedded Universal Flash Storage (eUFS) device.

2019-01-22 - Gary Hilson, EE Times

JEDEC Looks To Push HBM2 Limits

The Jedec Solid State Technology Association’s most recent update to the JESD235 HBM DRAM standard focuses on meeting the needs…

2019-01-17 - Junko Yoshida

New DRAM Architecture Targets Edge AI

Etron Technology revealed a brand-new DRAM architecture called “Reduced Pin Count” (RPC) DRAM, which uses only half the pins to…

2019-01-03 - Gary Hilson

Emerging Memories Show Promise for AI

Weebit Nano partnered with IITD on a collaborative research project that will apply ReRAM technology to neomorphic computer chips, which…

2018-12-19 - Dylan McGrath, EE Times

DRAM Sales Fest Nearing End

Market decline forecast following record years

2018-12-12 - Dylan McGrath, EE Times

Embedded MRAM Solutions Emerging

Intel, Samsung aiming to join GlobalFoundries in having production-ready tech

2018-12-03 - Gary Hilson

NVMe Making the Big Leagues

2018 "big year" for NVMe, 2019 looking to be even bigger