AMS withdraws from $2 billion wafer fab project
Delays may have caused AMS to lose confidence in the project or it feels it couldn’t meet timing requirements in…
Crossbar ReRAM chases terabyte non-volatile memory
The ReRAM is showing advantages over flash memory, including read latencies of 20 nanoseconds and write latencies of 12 nanoseconds.
JNC begins mass producing ES Fiber in Thailand
ES Fiber is a thermoplastic bicomponent fibre which can be heated and bonded to each other without using adhesives.
AVX moves to fight mineral smuggling
AVX has joined the Solutions for Hope project in finding due diligence options against illegal mining and smuggling of minerals…
Veterans optimistic of chip scaling at SIA event
Industry veterans discussed at annual SIA dinner what a breakthrough lithography system will do for the chip industry in the…
Slim Flash process cuts down embedded layers by 20%
MagnaChip plans to merge Slim Flash into various technologies, including BCD and high voltage.
Substrate-like PCB shrinks conductor trackwidths to 15µm
The AT&S Toolbox uses technologies such as insulated metallic substrate, flexible PCBs, interposers and chip embedding to deliver substrate-like printed…
Microbattery players corner key IP
Top patent holders could potentially block IP development for the booming microbattery market.
Globalfoundries rolls out 12nm FDSOI process
The company has announced a next-generation FDSOI process to follow on from the 22FDX process that is nearing production.
Consider using robots for mundane supply chain tasks
Systems handling SAP and MRP need overarching management by human operators, but most of these manual operations can also be…