Industry edges closer to EUV lithography deployment
After years of painfully slow development, EUV is now poised to be deployed in production beginning with the 7nm node.
Sanmina takes flex PCB performance to 15Gbps
The flex and rigid flex circuit assembly technology offers smaller form factor and reduced weight for military and aerospace equipment.
Why foundries need clear, public benchmarks
Over the last few years, the industry has embraced the idea of measuring a process node by PPA—performance, power and…
FastFlow-based X-ray system offers 3D image quality
The X7056-II system is ideal in production lines that require high throughput despite extensive inspection of hidden solder joints.
Process innovations enable versatile flex circuits
Roll-to-roll processing with advanced laser drilling capabilities have realised economies of scale for flex-circuit suppliers, allowing wider use in such…
Inline wet process eases multi-wafer texturing
The DW Pre Tex diamond-wire sawing for wafers and cells is a one-step, inline wet process that achieves an R<…
Machine vision gains FPGA-based programmability
The ZYNQ camera systems are based on a DualCore ARM with FPGA so that challenging image evaluation in real time…
GlobalFoundries to boost chip capacity worldwide
The company plans to roll out up to 40% capacity growth in the United States, Germany, China and Singapore.
GlobalFoundries builds 12-in wafer fab in China
The company plans to establish a 300mm fab in Chengdu.
Despite Trump’s call, Foxconn pursues China LCD fab
Foxconn plans to build a $8.8 billion factory in Guangzhou, China, which the company regards as “investment treasure land.”