3D IC success hinges on major foundries(2)
At the panel session, Abe Yee, a packaging expert at Nvidia, had some suggestions for the likes of Globalfoundries, Micron,…
Stanford top engineer weighs in on CMOS outlook(2)
I think you will see this expansion happening in Silicon Valley over next decade or two. The Valley will be…
ST, TJ FAW open joint automotive lab in China
STMicroelectronics and TIANJIN FAW Xiali Automobile (TJ FAW), a China-based automotive manufacturer, have inaugurated their joint automotive application laboratory in…
Hynix signs on partner for image sensor venture
Moving into the non-memory chip business, Hynix Semiconductor Inc. has entered into a partnership agreement with SiliconFile Technologies Inc., a…
Keithley device tests 300mm wafers in 200mm test times
Keithley Instruments Inc. has expanded its S600 series with the release of the S680DC/RF parametric test system that allows control…
Horiba backs environmental project in China
Horiba Ltd received a contract from the government of Chongqing city in China, to supply 25 automatic monitoring systems for…
Consortium may take over Bell Labs research facility
Lucent Technologies and Agere Systems Inc. are attempting to spin-off their nanotechnology and electron-beam lithography lab in Murray Hill, New…
Bonding mirrors to mounts
This application note discusses the best technique in applying adhesive to bond mirrors to mounts. View the PDF document for…