Liang Mong-song, a former employee at TSMC who leaked process technology to Samsung several years ago, has joined China's SMIC…
The low temperature hybrid wafer bonding allows wafers to be bonded with fine pitch 3D electrical interconnect without requiring bond…
The ReRAM is showing advantages over flash memory, including read latencies of 20 nanoseconds and write latencies of 12 nanoseconds.
Recruiting Taiwan’s veterans will help China’s chip industry accelerate their R&D upgrading, process technology and yield improvements.
The new fab, which has a total designed capacity of 40,000 wafers per month, is aimed at meeting demand for…
The deal marks SMIC’s first expansion of manufacturing beyond China and will also move the company into the global electronics…