Bi-directional TVS offers up to 36V breakdown voltage
The TVS features patented PAR construction for a temperature range of −65°C to 185°C.
Expanded test and yield analysis solution targets 7nm node
To improve defect coverage, Synopsys has been collaborating with semiconductor companies to advance testing and diagnostics methods for 7nm processes.
Mentor Graphics sells to Siemens for $4.5 billion
The acquisition extends Siemens Digital Enterprise Software portfolio with the addition of Mentor’s electronics IC and systems design solutions.
Ansys eyes safety analysis with Medini acquisition
Ansys is expanding its sofware portfolio to go beyond simulation and include systems safety analysis, reliability engineering and quality management.
IIoT: Standards needed for connectivity, security
Most early adopters believe little organisational change will be necessary to integrate IoT into their day-to-day operations. Are they right?
450mm focus shifts to 300mm, 200mm capacity
300mm wafers, which represented 63.1% of worldwide capacity in 2015, are forecast to increase to about 68% by the end…
Silicon Labs brings IoT RTOS in-house with Micrium buy
Micrium’s RTOS software has been ported to more than 50 microcontroller architectures.
Slim Flash process cuts down embedded layers by 20%
MagnaChip plans to merge Slim Flash into various technologies, including BCD and high voltage.
Wireless charging IC takes power transfer to 3W
The chipset enables 1W transfer just 11mm-dia coils in the receiver or up to 3W using larger coils and a…
Samsung, SAP set up Korea R&D for in-memory platform
The two companies plan to push for more advanced global in-memory market offerings by conducting research on next-generation DRAM.