Interlink to build $3.5M R&D facility in Singapore

Article By : EE Times Asia

As part of the expansion, the HMI solutions company plans to add 10 scientists and engineers to its Singapore team.

Human-machine interface (HMI) solution provider Interlink Technologies is investing $3.5 million in the next three years to expand its research and development centre in Singapore.

As part of the expansion, the California-based company plans to add 10 scientists and engineers to its Singapore team. The investment, meanwhile, will be used to establish a state-of-the-art facility in the country.

The global R&D team will pursue scientific research, technology platform development and advanced product development in areas of material science, printed electronics devices and manufacturing processes and multi-disciplinary system engineering, according to Interlink. The global R&D centre will also support strategic partnerships with key players in electronics manufacturing services, digital manufacturing including 3D printing and product development.

"The expansion of our global R&D centre in Singapore is part of our global corporate strategy to expand our international footprint and to leverage on Singapore’s human capital and ecosystem in science and engineering," said Intelink Electronics CEO Steven Bronson.

Aside from Singapore, Interlink Electronics has a printed electronics manufacturing facility in Shenzhen, China, and a global distribution and logistics centre in Hong Kong. The company also maintains technical and sales offices in Japan and in the United States.