IoT-optimised Exynos chip goes into mass production

Article By : EE Times Asia

Built on 28nm High-K Metal Gate (HKMG) process, Samsung's Exynos i T200 offers Wi-Fi connectivity and high processing capabilities needed for IoT use cases.

Samsung Electronics has initiated a full-scale production for its Exynos i T200, the first Exynos-branded chip targeting IoT applications.

Built on low-power 28nm High-K Metal Gate (HKMG) process, the Exynos i T200 offers Wi-Fi connectivity and high processing capabilities needed for IoT use cases. The chip is equipped with a Cortex-R4 processor and an additional Cortex-M0+ processor enabling a device to process and perform various tasks without adding an extra microcontroller IC in the system.

In terms of connectivity, Exynos i T200 supports 802.11b/g/n single-band (2.4GHz), according to Samsung. The processor has received Wi-Fi CERTIFIED from Wi-Fi Alliance, Microsoft Azure Certified for IoT. It also natively supports IoTivity, an IoT protocol standard from the Open Connectivity Foundation (OCF), which enables seamless interoperability between IoT devices.

To address security and privacy concerns, the Exynos i T200 has a separate and designated security management hardware block called the Security Sub-System (SSS). In addition, the Physical Unclonable Function (PUF) IP generates truly unique value for secure data storage and device authentication management without fusing a key onto silicon and relying on a discrete security IC for key storage. This security measure provides a much higher level of security compared to the conventional one-time programmable (OTP) based solutions, according to Samsung.