Fragile egg challenge: Designing displays to take the drop
The design challenge isn't about making the display stronger. That's simply not enough. It’s about the product and display being…
QD patterning process eases display production
South Korean researchers have demonstrated a large-scale, high-resolution quantum dot patterning process to ease production of QD displays and photonic…
3D TSV opens doors for new packaging strategies
TSVs have become the preferred interconnect choice for high-end memory, and an enabling technology for heterogeneous integration of logic circuits.
1000ppi IGZO display targets virtual reality
The high electron mobility of IGZO allows for transistor miniaturisation and circuit thinning, according to Sharp.
Qualcomm emerges big winner at Google’s event
As many as five of Qualcomm's chips are inside the Pixel phones, the Snapdragon 821, two PMICs, an audio codec…
Toshiba extends photorelay max temperature to 110°C
The higher operating temperature helps Toshiba meet demand for such applications as semiconductor testers.
CMOS TDI cameras deliver high-speed colour imaging
Data throughput of the 8k and 16k models is beyond 3GB/s on a single CX4 cable to aid inspection reliability.
ITRI’s foldable AMOLED integrates LTPS back panel
The Taiwanese research centre has adopted a transparent plastic cover plate with gas barrier and touch functions on top of…
Upstart energy fuels Hot Chips event
The best news of all comes from a handful of talks by young people in or emerging from academia. Their…
Hot Chips: Sharper pictures with quantum dots
The highly sensitive dots provide wider dynamic range and work in a broader spectrum area that silicon.