During ICCAD, EE Times China interviewed senior executives from EDA, IP, design services and foundry companies and discussed the development…
With the semiconductor industry's plans to transition to 450mm wafers on deep freeze, chipmakers are doubling down on 300mm fabs.
Researchers said monolithic 3D chip stacks have promise but face several challenges at an event attended by CEA-Leti, Qualcomm, ARM…