2016-07-28 - Peter Clarke

Achieving embedded MRAM, flash options for FDSOI at 28nm

Samsung's roadmap shows two phases of rollout for 28FDSOI: eFlash risk production by the end of 2017 and the eMRAM…

2016-07-27 - Gary Hilson

Tech promises to meet rising demand for flexible displays

Dubbed "SuPR-NaP," the printing technology allows manufacturers to produce accurate flexible touchscreen surfaces more quickly and cost effective.

2016-07-27 - Synopsys

Security tool analyses web app code, data flow at runtime

Seeker 3.8 can detect known vulnerabilities in web applications' open source and third-party software components through a turnkey integration.

2016-07-22 - Junko Yoshida

SoftBank banks hard on hardware

SoftBank’s CEO stresses that ARM will become central to the company's core biz, and that hardware is key to platform…

2016-07-22 - Peter Clarke

IoT to propel sensors, peripherals growth by 24% by 2021

ABI Research reckons sensors and peripherals will be 65% of an installed base of 47 billion units by 2021, double…

2016-07-21 - R. Colin Johnson

BeSang slashes 3D NAND flash cost to $0.02/GB

Frustrated with Hynix's slow implementation of its monolithic 3D technology, BeSang is opening the door to partnerships with other memory…

2016-07-19 - Artesyn

Nonisolated converter features up to 14V input voltage

For applications requiring higher current, up to four units can be connected in parallel to supply up to 320A as…

2016-07-15 - Alliance Memory

Low-voltage SDRAM delivers up to 1600Mbps/pin transfer rate

The 8GB DDR3L SDRAM operates from a single 1.35V power supply and is backwards-compatible with 1.5V power supplies to enable…

2016-07-14 -

Global PC shipments slide in Q2: Gartner

Lenovo maintains the top position in global PC shipments in the second quarter of 2016, despite a 2.2% drop in…

2016-07-07 - Duane Benson

USB Type-C in Micro-B domain

USB 3.1 spec can be a bit intimidating when compared to the USB Micro-B connector and the FTDI USB 2.0…