100Mbps data isolator integrates DC/DC converter
The ISOW7841 reduces device operating temperature by up to 40°C, resulting in higher power delivery and higher channel count, according…
PD controllers handle data, power with USB-IF seal
Weltrend’s WT6615F and WT6632F USB power delivery controllers support from 3V up to 30V range without an external LDO.
UMC begins mass production of 14nm ICs
UMC’s 14nm FinFET wafers feature 55% higher speed and twice the gate density over 28nm process technology.
Fully protected power connectors reduce size to 2.5mm
Molex’s Nano-Fit power connectors have multiple colour and mechanical keying options to help designers reduce the risk of cross mating.
TVS diodes secure high-speed interfaces in wearables
The TVS diodes are fabricated with EAP-IV process that utilises Toshiba’s snapback technology for improved system reliability.
Trench-type SiC MOSFETs reduce on-resistance by 50%
Rohm's third generation of SiC MOSFETs, SBDs and modules features switching capability, energy conversion efficiency, reduced on-resistance.
Start-up rolls out configurable power management ICs
AmP represents an FPGA-style approach to building power management ICs that can address about 90% of the topologies of power…
Configurable ICs aim to displace catalogue power devices
AnDapt's line of configurable ICs combines power MOSFETs, analog and digital circuitry and can be used to create a wide…
Toshiba process cuts RDS(ON) for MOSFET lineup
Toshiba has used its U-MOS IX-H series trench process to deliver efficiency across a wide range of load conditions by…
Low-dropout regulator comes in bumpless chip-scale package
The LDBL20’s bumpless package breaks through the minimum I/O-area and height limitation imposed by the diameter of traditional flip-chip solder…