Winbond supports accelerated roll-out of 5G CPE modems with release of 2Gb+2Gb NAND+LPDDR4x multi-chip package - EE Times Asia
New W71NW20KK1KW MCP’s non-volatile Flash/high-speed DRAM combination is optimized for cost and memory capacity in static 5G modem applications
ASPENCORE Asia736
