STMicroelectronics gets software support for smarter phones
A combination of STMicroelectronics' unique, flexible sensor architecture and Qualcomm All-Ways Aware sensor-processing abilities will emphasise performance and minimise power…
PowerVR GPU delivers advanced graphics for automotive apps
The SPHE6700 features support for up to 7-channel D1 or 4-channel HD camera input with full HD video encoder for…
China takes the world lead in supercomputers
China has built the world’s most powerful supercomputer with chips it manufactured locally, topping the U.S. for the first time…
China set to deliver supercomputer “Tianhe-3” by 2020
Tianhe-3, the next major milestone in supercomputing performance, is set to be released by China in 2020. But will its…
Zynq UltraScale+ family sees streamlined dual-core devices
The new family enables the development of flexible, standards-based platforms by providing 5X system-level performance/watt and any-to-any connectivity with the…
ESD protection device optimises transistor structure
Analysis of 3D simulations has allowed Toshiba to identify a mechanism for optimising transistor structure to boost ESD robustness.
Cavium, QLogic $1B deal expands data centre chips
The acquisition adds Qlogic's Fibre Channel and Ethernet controllers and boards to Cavium's line up of communications, security and general-purpose…
Latest SDSoC accelerates C/C++ based programming
Xilinx extends SDSoC development environment that enables software-defined programming of the 16nm Zynq Ultrascale+ MPSoC.
Do carmakers know what their self-driving car architecture will be in 2020? – Part 1
Do carmakers and tier ones today already know their autonomous car system architecture in 2020? EE Times' Junko Yoshida explores…
Do carmakers know what their self-driving car architecture will be in 2020? – Part 2
Find out about different autonomous car platforms and how they combine deep learning, sensor fusion and surround vision in the…