Covid-19: Closures in Southeast Asia Bring New Challenges
Our colleagues in China, Taiwan and other regions in Southeast Asia continue to report, from the ground, on the coronavirus's…
EU Project Sets Sights on Advanced Packaging
An EU-funded project has been launched to develop advanced packaging for photonics, optics and electronics for low-cost manufacturing.
Power Devices Boosted with New SiC Substrates
The scientific program will combine Soitec technology with that of Applied Materials, a leader in materials engineering solutions.
TSMC/Arm Unveil 3DIC Made of Chiplets
TSMC provided a peek at its plans for packaging three-dimensional chips that push performance higher, power consumption lower and transistor…
HybridPACK Drive: Modular power semiconductor solutions for a fast and flexible electrification of vehicles
For a fast and cost-efficient development of electric drivetrains, matching power modules for energy conversion and control in the main…
Intel Details 10nm 3D Stacked CPU
Intel uncorked a small geyser of news at the CES, including its first 10nm PC processor — Ice Lake —…
Intel Refreshes Desktop CPUs
Intel rolled out six new desktop processors, boosting CPU frequency at the high end and adding more x86 cores elsewhere.