2016-08-08 - Toshiba

512GB SSD comes in a size of SIM card

New single-package ball grid array SSDs can accommodate up to 512GB in 16mm × 20mm NVMe SSD form factor.

2016-08-07 - Alan Patterson

MediaTek struggles amidst rising chip demand

Chip maker MediaTek says it has underestimated the supply of chips it would need from its foundry partners.

2016-08-01 - Yole Developpement

STTMRAM to lead $4.6B non-volatile memory market in 2021

Non-volatile memory is still limited to niche markets due to limited densities, but this will change in the near future.

2016-07-28 - Peter Clarke

Achieving embedded MRAM, flash options for FDSOI at 28nm

Samsung's roadmap shows two phases of rollout for 28FDSOI: eFlash risk production by the end of 2017 and the eMRAM…

2016-07-26 - IC Insights

Mobile IC market forecasts 6.7% CAGR through 2019

Cell phone IC market CAGR will exceed total IC market CAGR by 3 points, according to IC Insights.

2016-07-22 - Junko Yoshida

SoftBank banks hard on hardware

SoftBank’s CEO stresses that ARM will become central to the company's core biz, and that hardware is key to platform…

2016-07-22 - Junko Yoshida

Architecture for AI, security can leverage SoftBank: IHS

Son envisions ARM to define a platform for the future of secure IoT, connected cars and artificial intelligence.

2016-07-21 - R. Colin Johnson

BeSang slashes 3D NAND flash cost to $0.02/GB

Frustrated with Hynix's slow implementation of its monolithic 3D technology, BeSang is opening the door to partnerships with other memory…

2016-07-19 - IC Insights

Mobile IC market to reach $94B in 2019

The cellphone IC market CAGR is forecast to exceed the total IC market by as much as three points during…

2016-07-19 - Peter Clarke

Japan Semi ramps up IC production

Japan Semi's Iwate and Oita operations are focusing on IC production, aiming 30% of its revenue to come from foundry…