Transition to substrates for ICs below 10µm begins
Future higher-end products will require package substrates with L/S
IIoT standard seeks to link wafer fabs with EMS
Some vendors are calling for the Electronics Manufacturing Service sector to adopt some version of automation standards already in use…
SMIC taps bonding tech for image sensor manufacturing
The low temperature hybrid wafer bonding allows wafers to be bonded with fine pitch 3D electrical interconnect without requiring bond…
China bets big on Industrial IoT
Efforts to lay out China's IIoT are still embryonicm but thanks to the IIoT application environment, the sector is growing…
IIoT growing faster than consumer IoT in China
The expectation is that China’s internet services and industrial applications will grow hand in hand to create diversified applications.
Projects target GaN processes, panel-level packaging
The GaNonCMOS project aims to develop reliable GaN processes, while the Panel-Level Packaging Consortium plans to implement PCB panel-level packaging.
Auto SoC reference platform accelerates design time
DCT’s SoC has been tapped by European THINGS2DO project to help create a camera-based ADAS reference platform using its data…
Cathode material boosts all-solid-state battery dev’t
FDK and Fujitsu have developed a lithium cobalt pyrophosphate cathode, paving the way for all-solid-state batteries with higher voltage and…
Intel tops semicon R&D spending
Intel accounts for about 23% of the $56.5 billion total worldwide semiconductor R&D expenditures in 2016, according to IC Insights.
Collaboration fuels future IoT start-ups
IBM, Indiegogo and Arrow Electronics have teamed up to give entrepreneurs free access to IBM's Watson IoT platform and discounts…