Imec demonstrates 24nm pitch lines with single exposure EUV lithography on ASML’s NXE:3400B scanner
24nm pitch resolution offers the imec patterning ecosystem a platform for early development towards high-NA EUV lithography
5G Demand Boosts Capital Expenditures for TSMC
TSMC reports soaring demand for its 7 nm line, due to worldwide development of 5G and accelerated demand from HPC,…
TSMC Leading the way in EUV Adoption
TSMC's boast that it is the first to commercialize EUV lithography is probably justified, according to analysts.
TSMC Announces Large-Scale Hiring Plan
TSMC plans to hire 3,000 people, or about 5% of its current headcount, to support the company's business growth and…
Opinions Differ over the Future of Moore’s Law
New chip architectures will drive semiconductors beyond what some see as a profound decline in Moore's law said CEOs of…
Blog: The Impact of the Japan-Korea Trade War
By restricting exports of key chemical materials to South Korea, Japan has already done irreparable harm to the global electronics…
EUV Ready but still has its Challenges
Extreme ultraviolet lithography still faces reliability issues, but it's ready for volume use, Intel's EUV chief said
Samsung Races Ahead with Gate-All-Around Technology
Headstart over TSMC could give Samsung a leg-up in the post-FinFET era
Users Must Wait Until 2021 for Intel’s 7-nm
With yield woes contained, executives say the company will meet its holiday season target.
TSMC Adds a N5P process
The Taiwan foundry sketched out a laundry list of processes and packaging options including a new N5P node at an…