PLM software fuses BOM/process data
NEC’s Obbligato III R4.1 manages bills of material for part types and quantities, as well as BOP for developing processes,…
IBM opens Watson Centre in Singapore to scale AI, blockchain apps
The three new facilities are located at the heart of Singapore's financial district, aiming to drive develpoment and commercialisation of…
Photodiode amp exhibits lower output noise
Cooling the resistor reduces the noise, but can you do better without cooling? Is it possible to beat the 130-nV…
AI platform advances mfg, production quality
Fujitsu launches an expert consulting service that will support the implementation of AI technology in customer manufacturing locations using the…
Carbon Nanofibres key to shrinking IC packaging
Technology provider Smoltek stated that carbon nanofibres (CNFs) are key to shrinking IC packaging. Founded in 2005, the Swedish startup…
A*STAR IME’s consortium advances MEMS for industrial, IoT apps
A*STAR IME's collaborative partnership with industry will enable the development of industrial-grade sensors to increase the performance and develop cost-efficient…
Silvaco buys IPextreme as ticket to IP arena
Silvaco aims to allow semiconductor companies and IP development companies to monetise their captive IP assets and bring high quality,…
Accurate USB temperature sensor has minimal parts
At the heart of this simple, accurate, and reliable USB temperature sensor is a USB-to-serial converter.
ASIC/SoC designs: Custom corner characterisation
Characterisation tools these days offer a good solution for extracting the best performance out of an ASIC/SoC for any specified…
OVP Fast Processor Model aimed at Renesas RL78 CPU
The RL78 model, developed by eSOL TRINITY, Imperas’ partner in Japan, provides technical support for Imperas customers as well as…