2017-04-18 - EE Times Asia

SMT inductors comply with military’s failure rating

Level M represents the first level of failure rating for off-the-shelf inductors for high-reliability applications, according to Gowanda.

2017-04-12 - EE Times Asia

Kyocera claims smallest crystal unit for smartphones

The company has used plasma technology to manufacture quartz crystal units that measure 1mm x 0.8mm, yet deliver the same…

2017-04-04 - EE Times Asia

Dry etching system allows uniform Descum, Ti process

The NA-1500 dry etching system provides stable transfer and processes without abnormal discharge, according to Ulvac.

- Rick Merritt

FinFETs compete with FD-SOI

Intel has its own internal products already being designed for 22FL as well as hopes to attract foundry customers.

2017-03-21 - Rick Merritt

TSMC advances push into 3nm, machine learning

The six-track 12nm FinFET process is an upgrade for midrange mobile and video processors and high-end IoT devices using 16FFC,…

- Rick Merritt

TSMC’s first-gen 7nm starts its ramp

The foundry is developing unique flavours of its processes tailored to needs of automotive, smartphone, high-performance computing and IoT markets.

- Rick Merritt

EUV rolls into TSMC’s 7+nm node in 2018

TSMC has used an unnamed “novel resist” chemical to replace five immersion masks with one EUV mask at pitches ranging…

- Rick Merritt

TSMC unveils plans for 7+, 12, 22nm nodes

TSMC has clearly focused on easing migrations for designers, sometimes at the expense of advances measured in single digits.

2017-03-20 - Silicon Labs

Multiprotocol SoCs offer up to 19dBm output power

The Wireless Gecko SoCs support Zigbee and Thread mesh networking, Bluetooth 5 and proprietary wireless protocols, according to Silicon Labs.

2017-03-17 - Renesas

Embedded platform adds Wi-Fi software, MCUs, tests

Synergy Software Package v1.2.0 features integrated API, Wi-Fi framework, MCU series and documented SQA for a complete embedded platform.